CMOS

Bond wires in Integrated Circuits

This entry was posted in Circuits and tagged CMOS Packaging on by

[Could not find the bibliography file(s) An integrated circuit on a die is connected to external world through bond wires. Depending on the packaging or assembly technique we use, the bond wire length changes. The self or mutual inductance of the bond wire is directly proportional to length and have […]

What is Electromigration?

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Under the conditions of high current densities and high temperatures in metals, there is momentum transfer between conducting electrons and diffusing metal atoms. This causes gradual drift of the ions in the metal in the direction of electron flow and result in mass transport. This process of material transfer is […]